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Cited article:

Analysis of Electrical Resistance Behavior and Oxide Film Growth Mechanism by Low-Temperature Oxidation of Copper Wiring in Printed Circuit Boards

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Journal of The Japan Institute of Electronics Packaging 25 (6) 626 (2022)
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Review of preparation and optoelectronic characteristics of Cu2O-based solar cells with nanostructure

Lung-Chien Chen
Materials Science in Semiconductor Processing 16 (5) 1172 (2013)
https://doi.org/10.1016/j.mssp.2012.12.028

Influence of oxide grain morphology on formation of the CuO scale during oxidation of copper at 600–1000°C

Y. Zhu, K. Mimura and M. Isshiki
Corrosion Science 47 (2) 537 (2005)
https://doi.org/10.1016/j.corsci.2004.06.020

Transport Considerations in the Plasma-Assisted Oxidation of Copper Films

Yiming Li and Dennis W. Hess
Journal of The Electrochemical Society 151 (1) G40 (2004)
https://doi.org/10.1149/1.1630039

Oxidation behavior of copper at high temperatures under two different modes of direct-current applications

S. K. Roy, V. Ananth and S. K. Bose
Oxidation of Metals 43 (3-4) 185 (1995)
https://doi.org/10.1007/BF01047027

The transition from single to double oxide growth during the high temperature corrosion of a pure metal by a single oxidant

F. Gesmundo, F. Viani and D. J. Young
Oxidation of Metals 38 (3-4) 309 (1992)
https://doi.org/10.1007/BF00666918

Growth, structure, and physical properties of single‐phase metastable fcc Cu1−xCrxsolid solutions

D. McIntyre, J.‐E. Sundgren and J. E. Greene
Journal of Applied Physics 64 (7) 3689 (1988)
https://doi.org/10.1063/1.341412

High-temperature oxidation of copper-manganese alloys

P. Nanni, F. Viani, P. Elliott and F. Gesmundo
Oxidation of Metals 13 (2) 181 (1979)
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The formation of multilayer scales in the parabolic oxidation of pure metals—I. Relationships between the different rate constants

F. Gesmundo and F. Viani
Corrosion Science 18 (3) 217 (1978)
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МЕХАНИЗМ ПОВЕРХНОСТ НОГО ОКИСЛЕНИЯ МЕДИ

Miloš Matyáš
Czechoslovak Journal of Physics 5 (2) 222 (1955)
https://doi.org/10.1007/BF01689206