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Cited article:

Effect of Temperature Gradient and Cooling Rate on the Solidification of Iron: A Molecular Dynamics Study

Qin Qin, Weizhuang Li, Wenrui Wang, Dongyue Li and Lu Xie
Materials 17 (24) 6051 (2024)
https://doi.org/10.3390/ma17246051

The effect of nano-void on deformation behaviour of Al-Cu intermetallic thin film compounds

Natraj Yedla, Md. Meraj, Pradeep Gupta, et al.
Metallurgical Research & Technology 112 (5) 505 (2015)
https://doi.org/10.1051/metal/2015033