Transverse heterogeneity of interfacial bonding behavior during roll bonding of Cu/Al bimetallic platesXiang Yu Gao, Tao Wang, Zhong Kai Ren, Jian Chao Han, Dong Ping He and Sha LiMetall. Res. Technol., 116 6 (2019) 633DOI: https://doi.org/10.1051/metal/2019058
