| Issue |
Rev. Met. Paris
Volume 90, Number 12, Décembre 1993
|
|
|---|---|---|
| Page(s) | 1631 - 1636 | |
| DOI | https://doi.org/10.1051/metal/199390121631 | |
| Published online | 20 January 2017 | |
Growth kinetics, polymerization and protection of Cu-X-BTA filmsss
Cinétique de croissance, polymérisation et caractère protecteur de films de Cu-X-BZT
Corrosion and oxidation of copper films were evaluated as a function of surface pretreatment with inhibitors. Electrochemical measurements, accelerated corrosion tests and thermal oxidation were used. Copper surfaces were characterized by ellipsometry. Auger electron spectroscopy, time-of-flight static SIMS, high temperature-Knudsen effusion-mass spectrometry and Kelvin probe. Cu does not react with 1 OH-BTA and 1 CH3-BTA. However, 5 CH3-BTA, 5 CI-BTA and 1 H-BTA form protective surface films with a number of similar characteristics : growth kinetics, thermal stability, degree of polymerization and surface wetting. The extent of corrosion protection provided by these films is comparable in many cases. However, in chloride-containing atmospheres, surfaces treated with 5 CI-BTA are the most resistant to corrosion.
© La Revue de Métallurgie 1993
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