Regular Article

Solid solution behavior of Cu-1.0Cr-0.1Zr alloy

¹ School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan, Shanxi 030024, PR China
² Heavy Castings and Forgings Engineering Technology Research Center of Shanxi Heavy Castings and Forgings Engineering Technology Research Center, Taiyuan, Shanxi 030024, PR China
³ Taiyuan Jinxi Chunlei Copper Co., Ltd., Taiyuan, Shanxi 030003, PR China

^* e-mail: chen_huiqin@126.com

Received: 14 September 2021
Accepted: 2 March 2022

Abstract

Solid solution treatment on Cu-1.0Cr-0.1Zr alloy was performed at different temperatures and holding times to study the impact on solid solution behavior. At low temperatures, the results show that solid solutions do not form in the Cr-rich phase, but they start to form when temperatures rise above 900 °C. The dissolution rate first increases and then decreases, as temperatures approach higher values. At 950 °C, substantial solid solution forms, and as the holding time extends, the dissolution rate gradually decreases until the formation of solid solution completed. The pinning of dislocations by the Cr-rich phase leads to fine grain generation in the structure to further enhance the strength and lower the conductivity. Formation of solid solution completes when held at 950 °C for 120 min. The strength is 63.7 HB and conductivity is 34.5% IACS. Solid solution increases strength and resistivity by 43.91% and 63.59%, respectively.