Influence of strain path on texture and microstructural development in polycrystalline Cu and Cu-5 wt % Al alloy

Influence du chemin de déformation sur la texture et l’évolution de la microstructure du cuivre polycristallin et d’un alliage Cu-5 % Al

Abstract

Polycrystalline Cu and Cu-5 wt % Al alloy were rolled to 50 % reduction and compressed additionally 30 % in a channel die. For part of the compressed material, the direction of plastic flow was parallel to the transverse direction of former rolling. For the rest of the material, the direction of plastic flow was the same as during rolling. Examinations of the texture and microstructure after deformation and recrystallization were performed. For copper, the changes in deformation path alters the crystallographic texture while the microstructure remains relatively homogeneous. In contrast, changes in deformation path applied to the alloy reveal that the structure rather than the texture is significantly altered. In the alloy, the great number of shear bands crossing several grains was the predominant feature of the microstructure. The kinetic of recrystallization depends on the changes of the direction of plastic flow during secondary deformation only for the CuAI alloy. In this case, recrystallization proceeds first in shear bands resulting in nonuniform grain size after recrystallization.